Jiangsu University of Science and Technology Researcher Details Research in Electronics (Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock)

Press/Media: Press / Media

PeriodMar 27 2023

Media coverage

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Media coverage

  • TitleJiangsu University of Science and Technology Researcher Details Research in Electronics (Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock)
    Media name/outletElectronics Daily
    Country/TerritoryUnited States
    Date3/27/23
    PersonsYu Zhang
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