Simplifying ESD Protection and Inter-Chiplet Signaling In Future 2.5D/3D Packaging Technologies (Arizona State, Univ. of Minnesota)

Media coverage

• Title	Simplifying ESD Protection and Inter-Chiplet Signaling In Future 2.5D/3D Packaging Technologies (Arizona State, Univ. of Minnesota)
  Media name/outlet	Semiconductor Engineering
  Country/Territory	United States
  Date	11/25/25
  Persons	Chaitali Chakrabarti, Jeff Zhang