Grants per year
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- 1 Similar Profiles
Collaborations and top research areas from the last five years
Grants
- 3 Finished
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3D Printed Heat Exchangers with Creative Internal Patterns
Kwon, B. (PI)
Jet Propulsion Laboratory (JPL), National Aeronautics Space Administration (NASA)
10/20/21 → 9/27/24
Project: Research project
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Collaborative Research: CDS&E: Learning Convective Heat Transfer from Mass Transfer Visualization
Kwon, B. (PI)
National Science Foundation (NSF)
6/1/21 → 5/31/24
Project: Research project
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Thermal and electrical transports in metal coated nanocarbon materials
Kwon, B. (PI)
1/1/21 → 12/31/22
Project: Research project
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Deep learning model for rapid temperature map prediction in transient convection process using conditional generative adversarial networks
Kang, M., Phuong Nguyen, N. & Kwon, B., Mar 2024, In: Thermal Science and Engineering Progress. 49, 102477.Research output: Contribution to journal › Article › peer-review
3 Scopus citations -
Understanding heat transfer and flow characteristics of additively manufactured pin fin arrays through laser-induced fluorescence and particle image velocimetry
Nguyen, N. P., Maghsoudi, E., Roberts, S. N., Hofmann, D. C. & Kwon, B., May 1 2024, In: International Journal of Heat and Mass Transfer. 222, 125198.Research output: Contribution to journal › Article › peer-review
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Application of machine learning in heat transfer from correlations to design
Kwon, B., Ejaz, F., Ohashi, N. & Hwang, L. K., Jan 2023, Advances in Heat Transfer. Abraham, J. P., Gorman, J. M. & Minkowycz, W. J. (eds.). Academic Press, p. 227-250 24 p. (Advances in Heat Transfer; vol. 56).Research output: Chapter in Book/Report/Conference proceeding › Chapter
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Shape optimization of pin fin array in a cooling channel using genetic algorithm and machine learning
Nguyen, N. P., Maghsoudi, E., Roberts, S. N. & Kwon, B., Mar 2023, In: International Journal of Heat and Mass Transfer. 202, 123769.Research output: Contribution to journal › Article › peer-review
21 Scopus citations -
A two-dimensional finite element model for Cu-CNT composite: The impact of interface resistances on electrical and thermal transports
Ejaz, F., Kang, M., Son, J., Kim, J. S., Lee, D. S. & Kwon, B., Aug 2022, In: Materialia. 24, 101505.Research output: Contribution to journal › Article › peer-review
2 Scopus citations
Press/Media
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U of I Researchers Demonstrate New Capability for Electronics Cooling Using Additive Manufacturing.(AROUND THE WORLD)
4/1/20
1 item of Media coverage
Press/Media: Press / Media
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U of I Researchers Demonstrate New Capability for Electronics Cooling Using Additive Manufacturing
2/19/20
2 items of Media coverage
Press/Media: Press / Media
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University of Illinois researchers demonstrate new capability for cooling electronics
2/17/20 → 2/18/20
3 items of Media coverage
Press/Media: Press / Media
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US Patent Issued to Korea Institute of Science and Technology on Jan. 7 for "Method for manufacturing thermoelectric material having high efficiency" (South Korean Inventors)
1/29/20
1 item of Media coverage
Press/Media: Press / Media