Grants per year
Personal profile
Education/Academic qualification
PHD, University of Massachusetts-Amhurst
… → 1989
MS EE, Polytechnic University
… → 1985
BS EE, Polytechnic University
… → 1982
Fingerprint
Dive into the research topics where James Aberle is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Grants
- 21 Finished
-
Operational Testing and Improvements of the ASU Smallsat Ground Station
Bell, J. (PI), Aberle, J. (CoI) & Groppi, C. (CoI)
National Aeronautics Space Administration (NASA)
11/20/17 → 9/28/18
Project: Research project
-
High Efficiency Radiators for Conformal ULtra-wideband Electromagnetic Systems (HERCULES)
Diaz, R. (PI), Aberle, J. (CoI) & Sieradzki, K. (CoI)
DOD-USAF: Air Force Research Labs (AFRL)
10/17/16 → 5/31/19
Project: Research project
-
Electromagnetics Materials Advice on Nano-Ferrite Development
Aberle, J. (PI) & Diaz, R. (CoI)
DOD-ARMY-ARL: Army Research Office (ARO)
9/1/16 → 3/14/17
Project: Research project
-
High Hesitivity Magnetic Materials for Magnetic Toroid and Flat Dipole Antennas
Aberle, J. (PI), Sieradzki, K. (CoI) & Diaz, R. (CoI)
DOD-NAVY: Office of Naval Research (ONR)
5/23/16 → 12/30/16
Project: Research project
-
Frequency Independent Distributed Impedance Magnetic Flux Channel Antennas
Aberle, J. (PI) & Diaz, R. (CoI)
DOD-NAVY: Office of Naval Research (ONR)
10/14/15 → 2/13/17
Project: Research project
-
2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects
Geyik, C. S., Hill, M. J., Zhang, Z., Aygun, K. & Aberle, J. T., 2022, 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022. Institute of Electrical and Electronics Engineers Inc., (IEEE Electrical Design of Advanced Packaging and Systems Symposium; vol. 2022-December).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Scopus citations -
Impact of Measurement Uncertainty on Correlation Quality for High-Speed Interconnects
Geyik, C. S., Hill, M. J., Zhang, Z., Aygun, K. & Aberle, J. T., Sep 2021, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 11, 9, p. 1380-1390 11 p., 9502117.Research output: Contribution to journal › Article › peer-review
Open Access4 Scopus citations -
Machine learning for evaluating the impact of manufacturing process variations in high-speed interconnects
Geyik, C. S., Zhang, Z., Aygun, K. & Aberle, J. T., Apr 7 2021, Proceedings of the 22nd International Symposium on Quality Electronic Design, ISQED 2021. IEEE Computer Society, p. 160-163 4 p. 9424359. (Proceedings - International Symposium on Quality Electronic Design, ISQED; vol. 2021-April).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
12 Scopus citations -
Novel methodology to assess RF performance of co-located MIMO radar systems transmitting binary phased coded waveforms
Colon-Diaz, N., Janning, D., McCormick, P. M., Aberle, J. T. & Bliss, D. W., Aug 2021, In: Applied Computational Electromagnetics Society Journal. 36, 8, p. 1116-1119 4 p.Research output: Contribution to journal › Article › peer-review
-
Measurement uncertainty propagation in the validation of high-speed interconnects
Geyik, C. S., Hill, M. J., Zhang, Z., Aygun, K. & Aberle, J. T., Oct 2020, EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems. Institute of Electrical and Electronics Engineers Inc., 9231369. (EPEPS 2020 - IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
6 Scopus citations