Material Science
Solder Joint
100%
Mechanical Strength
71%
Finite Element Method
66%
Intermetallics
62%
Three Dimensional Printing
60%
Powder
56%
Carbon Nanotube
52%
Grain Size
51%
Finite Element Modeling
44%
Lead-Free Solder
43%
Damage Evolution
39%
Magnesium Alloys
39%
Mechanical Property
38%
Anisotropy
37%
Nanoindentation
33%
Fatigue Damage
31%
Density
30%
Electronic Circuit
27%
Creep
23%
Inconel 718
23%
Silicon
23%
Viscoplastic Material
22%
Yield Stress
22%
Electron Backscatter Diffraction
20%
Elastic Moduli
20%
Experimental Design
20%
Thermal Cycling
20%
Solidification
17%
Materials Property
16%
Strain Rate
15%
Crack Initiation
15%
Powder Bed Fusion
14%
Low-Cycle Fatigue
14%
Crystal Plasticity
13%
Mechanical Testing
13%
Grain Boundary
13%
Work Hardening
12%
Crystal Microstructure
12%
Electron Beam Powder Bed Fusion
12%
Crack Propagation
11%
Cohesive Zone Model
10%
Nanocrystalline
9%
Single Crystal
9%
Fatigue Crack
9%
Ultimate Tensile Strength
8%
Thermal Property
8%
Diffusivity
7%
Volume Fraction
7%
Plastic Deformation
7%
Energy Density
7%
Engineering
Joints (Structural Components)
49%
Finite Element Method
36%
Carbon Nanotube
33%
Free Solder
33%
Fatigue Damage
32%
Interconnects
32%
Microstructure
30%
Powder Bed
27%
Additive Manufacturing
27%
Powder Bed Fusion
25%
Damage Model
24%
Finite Element Modeling
23%
Damage Evolution
19%
Mg-Al Alloy
19%
Defects
17%
Melt Pool
16%
Room Temperature
16%
Computer Simulation
15%
Three Dimensional Integrated Circuits
15%
Crack Initiation
15%
Frequency Domain
14%
Intermetallics
14%
Structural Reliability
14%
Melting Process
14%
Energy Engineering
14%
Model Constant
14%
Integral Abutment Bridge
13%
Porosity
13%
Fatigue Crack Propagation
13%
Interdiffusion
13%
Damage Initiation
13%
Cohesive Interface
13%
Scatterer
13%
Laser Interaction
13%
Propagation Path
12%
Microscale
12%
Damage Propagation
12%
Heat Source
12%
Creep
12%
Additive Manufacturing Process
11%
Fatigue Life
10%
Process Parameter
10%
Ball Grid Arrays
10%
Young's Modulus
9%
Damage Threshold
9%
Laser Power
9%
Bead Geometry
9%
Increasing Temperature
9%
Soft Material
9%
Temperature Profile
9%
Keyphrases
Integral Abutment Bridge
13%
High Temperature
13%
Al-Mg Alloy
13%
Fatigue Damage Evolution Model
13%
Joint Simulation
13%
Ultrafine Grain
13%
Room Temperature
9%
Pb-free Solder
9%
Peak Density
9%
Bimodal Grain Size
9%
BGA Solder Joint
9%
Pressure Magnitude
8%
Quantitative Ultrasound
8%
Metallic Powder
7%
Void Size
7%
Structural Size Combinations
6%
Failure Characterization
6%
Combined Chemical
6%
Diffusion Mechanism
6%
Specific Heat Capacity
6%
Chemical Reaction Mechanism
6%
Thermal Diffusivity
6%
Surgical Margin
6%
Microspecimen
6%
Solid-liquid Coupling
6%
IMC Growth
6%
High-temperature Melting
6%
Analytical Phase
6%
Shear Stress-strain
6%
Cycling Durability
6%
Surface Mount Assembly
6%
Mechanical Fatigue
6%
Lateral Displacement
6%
Pile Behavior
6%
Laser Additives
6%
Single Grain
6%
Response Variable
6%
Cyclic Damage
6%
Cu6Sn5
6%
Single-walled Carbon Nanotubes Bundles
6%
Damage Evolution
6%
Thermomechanical
6%
Fatigue Crack Propagation
6%
Breast Tumor
6%
Multilayer Specimen
6%
Finite Element Modeling
6%
Standoff Height
6%
Pb-free
6%
Stochastic Finite Element
6%
Fatigue Damage Evolution
6%
