Engineering
Boundary Condition
25%
Bubble Formation
6%
Channel Wall
8%
Circular Orifice
11%
Closed Loop
7%
Computer Simulation
9%
Constant Heat Flux
18%
Convective Boiling
14%
Convective Flow
6%
Cooling System
17%
Eutectics
9%
Experimental Result
7%
Fast Axis
6%
Filled Particle
18%
Flow in Channels
7%
Flow Regime
9%
Flowrates
10%
Heat Flux
24%
Heat Generation
12%
Heat Losses
9%
Heat Transfer Coefficient
12%
Hydraulic Diameter
20%
Interstitial Fluid Flow
6%
Linear Polarizer
6%
Liquid Crystal
10%
Material Interface
18%
Micro-Jet
13%
Microchannel
100%
Microelectromechanical System
9%
Microprocessor Chips
10%
Microscale
9%
Multichannel
6%
Nucleate Boiling
9%
Particle Volume
9%
Power Density
11%
Pressure Drop
21%
Rectangular Channel
6%
Retarders
9%
Sectional Dimension
6%
Temperature Distribution
26%
Temperature Rise
14%
Thermal Characterization
18%
Thermal Conductivity
5%
Thermal Resistance
13%
Thermal Sensor
15%
Thin Films
9%
Transients
9%
Transmissions
9%
Two-Phase Flow
22%
Void Growth
9%
Keyphrases
Advanced Cooling
9%
Boiling Flow
9%
Boiling Regimes
7%
Carbon Nanotubes
9%
Cell Growth
9%
Channel Wall
7%
Chip Cooling
12%
Closed-loop
12%
Constant Heat Flux Boundary Condition
18%
Convection
9%
Convective Boiling
9%
Cooling System
12%
DI Water
9%
Electroosmosis
9%
Electroosmotic Pump
9%
Etched Silicon
7%
Eutectic Alloy
9%
Heat Exchanger
9%
Heat Generation
12%
Heat Transfer Study
9%
High Power
8%
Hotspot Cooling
9%
Hydraulic Diameter
16%
Impingement Cooling
9%
Liquid Impingement
18%
Materials with Voids
9%
MEMS Devices
9%
Microchannel Cooling
15%
Microchannel Gas Flow
9%
Microchannel Heat Sink
18%
Nerve Cells
9%
Neuronal Morphogenesis
9%
Nucleate Boiling
9%
Postnatal Microcephaly
9%
Pressure Drop
16%
Saturation Temperature
9%
Solid Conduction
9%
Spatially Variable
15%
Temperature Distribution
10%
Temperature Sensor
11%
Thermal Characterization
9%
Thermal Conductivity
6%
Thermal Conductivity Enhancement
9%
Thermal Interface Materials
9%
Transient Boiling
9%
Two-phase Flow
15%
VLSI chip
9%
VLSI Circuits
9%
Wall Superheat
13%
Wall Temperature Distribution
7%