Keyphrases
FEM Modeling
100%
X-ray Computed Tomography (X-CT)
100%
Electronic Packing
100%
Defect Detection
100%
Electronic Packaging
100%
Environmentally Benign
50%
High-resolution
50%
Noninvasive Visualization
50%
Conventional Detection
50%
Solder Joint
50%
Tomographic Images
50%
Lead-free Solder Joints
50%
Pb-Sn Solder
50%
Copper Interconnect
50%
Pb-free Solder
50%
Deformation Behavior
50%
Semiconductor Industry
50%
Small Length Scale
50%
Nondestructive Detection
50%
Industrial Components
50%
Predictive Ability
50%
Successful Implementation
50%
Microstructural
50%
Material Science
Lead-Free Solder
100%
Tomography
100%
Solder Joint
100%
Polishing
50%
Density
50%
Engineering
Defects
100%
Interconnects
50%
Free Solder
33%
Joints (Structural Components)
33%
Electronic Packaging
33%
Deformation Behavior
16%
Successful Implementation
16%
Length Scale
16%
Cross Section
16%
High Resolution
16%
Predictive Capability
16%