A bulk microfabricated multi-axis capacitive cellular force sensor using transverse comb drives

Yu Sun; Bradley J. Nelson; David P. Potasek; Eniko Enikov

doi:10.1088/0960-1317/12/6/314

A bulk microfabricated multi-axis capacitive cellular force sensor using transverse comb drives

Yu Sun, Bradley J. Nelson, David P. Potasek, Eniko Enikov

Research output: Contribution to journal › Article › peer-review

160 Scopus citations

Abstract

This paper presents design, fabrication and calibration results for a novel 2-DOF capacitive force sensor capable of resolving forces up to 490 μN with a resolution of 0.01 μN in x, and up to 900 μN with a resolution of 0.24 μN in y. A simple fabrication process using deep reactive ion etching (DRIE) on silicon-on-insulator (SOI) wafers forms the 3D high aspect ratio structure. A transverse mode comb drive movement is used to greatly improve device sensitivity. Among other advantages of the developed process is a dice-free release of wafer structures, allowing fragile structures to be individually packaged. Notching or footing effects and bowing effects are well-known problems in DRIE on SOI wafers. Techniques to overcome notching and bowing effects using a PlasmaTherm SLR-770 etcher are presented that do not require hardware modifications. The application of the force sensor is for providing real-time force feedback during individual cell manipulation tasks.

Original language	English (US)
Pages (from-to)	832-840
Number of pages	9
Journal	Journal of Micromechanics and Microengineering
Volume	12
Issue number	6
DOIs	https://doi.org/10.1088/0960-1317/12/6/314
State	Published - Nov 2002

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Mechanical Engineering
Electrical and Electronic Engineering

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Cite this

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title = "A bulk microfabricated multi-axis capacitive cellular force sensor using transverse comb drives",

abstract = "This paper presents design, fabrication and calibration results for a novel 2-DOF capacitive force sensor capable of resolving forces up to 490 μN with a resolution of 0.01 μN in x, and up to 900 μN with a resolution of 0.24 μN in y. A simple fabrication process using deep reactive ion etching (DRIE) on silicon-on-insulator (SOI) wafers forms the 3D high aspect ratio structure. A transverse mode comb drive movement is used to greatly improve device sensitivity. Among other advantages of the developed process is a dice-free release of wafer structures, allowing fragile structures to be individually packaged. Notching or footing effects and bowing effects are well-known problems in DRIE on SOI wafers. Techniques to overcome notching and bowing effects using a PlasmaTherm SLR-770 etcher are presented that do not require hardware modifications. The application of the force sensor is for providing real-time force feedback during individual cell manipulation tasks.",

author = "Yu Sun and Nelson, {Bradley J.} and Potasek, {David P.} and Eniko Enikov",

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AU - Nelson, Bradley J.

AU - Potasek, David P.

AU - Enikov, Eniko

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A bulk microfabricated multi-axis capacitive cellular force sensor using transverse comb drives

Abstract

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