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Application of process simulation for comparison of contactless and conventional electrodeposition methods for 3D packaging

  • M. Zhao
  • , K. Jakes
  • , K. Luke
  • , J. Kishore
  • , R. Gouk
  • , S. Verhaverbeke
  • , Farhang Shadman
  • , Manish K Keswani

Research output: Contribution to journal › Article › peer-review

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