TY - GEN
T1 - Assembly of hybrid magnetic microdevices
AU - Vikramaditya, Barmeshwar
AU - Nelson, B. J.
AU - Yang, Ge
AU - Enikov, Eniko T.
N1 - Funding Information: This research was funded in part by Seagate Advanced Concepts Group. Publisher Copyright: © 2000 by ASME.
PY - 2000
Y1 - 2000
N2 - In this paper we present results of our task of assembly of hybrid magnetic MEMS devices. The contact phase of assembly for MEMS devices is complicated by the presence of surface effect and magnetic forces. This forces a path planning strategy that accounts for the mechanics of part interactions at such scales for all contact phases in order to guarantee successful and repeatable assemblies. To validate and demonstrate the applicability of microassembly strategies, we have developed a flexible automated microassembly workcell with integrated part handling skills which is also described.
AB - In this paper we present results of our task of assembly of hybrid magnetic MEMS devices. The contact phase of assembly for MEMS devices is complicated by the presence of surface effect and magnetic forces. This forces a path planning strategy that accounts for the mechanics of part interactions at such scales for all contact phases in order to guarantee successful and repeatable assemblies. To validate and demonstrate the applicability of microassembly strategies, we have developed a flexible automated microassembly workcell with integrated part handling skills which is also described.
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U2 - 10.1115/IMECE2000-2440
DO - 10.1115/IMECE2000-2440
M3 - Conference contribution
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 917
EP - 924
BT - Dynamic Systems and Control
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Y2 - 5 November 2000 through 10 November 2000
ER -