Abstract
One of the defects during the re-flow soldering in printed circuit boards is the defect of tombstone. It is a chip component that has partially or completely lifted off one end of the surface of the pad. Tombstones may be caused by several factors. In this paper, a description of the problem is presented with the factors that cause tombstones. Data mining approaches are presented to identify the factors that are significant. Data was collected over a period of one year to study this problem. Results are presented with suggested improvements.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 69-83 |
| Number of pages | 15 |
| Journal | Journal of Advanced Manufacturing Systems |
| Volume | 3 |
| Issue number | 1 |
| DOIs | |
| State | Published - Jun 2004 |
Keywords
- Data mining
- Defect diagnosis
- Quality control
- Tombstones
ASJC Scopus subject areas
- Computer Science Applications
- Strategy and Management
- Industrial and Manufacturing Engineering
Fingerprint
Dive into the research topics of 'Case study: Applying data mining to defect diagnosis'. Together they form a unique fingerprint.Cite this
- APA
- Standard
- Harvard
- Vancouver
- Author
- BIBTEX
- RIS