Characterization of thin photosensitive polyimide films for future metallization schemes

Terry Alford, Y. L. Zou, Kaustubh S. Gadre, N. David Theodore, W. Chen

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations


PSPI was characterized to determine thermal, mechanical, and morphological properties. It was found to possess excellent thermal stability characterized by a thermal decomposition temperature of 450°C and an average thermal expansion coefficient of 20×10-6/°C. The dielectric constants were 3.0 in the in-plane and 2.6 in the out-of-plane directions.

Original languageEnglish (US)
Pages (from-to)1253-1258
Number of pages6
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Issue number4
StatePublished - Jul 2001
Event19th North American Conference on Molecular Beam Epitaxy (NAMBE-19) - Tempe, AZ, United States
Duration: Oct 15 2000Oct 18 2000

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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