TY - GEN
T1 - Diagnosis of assembly failures for system-in-package RF tuners
AU - Erdogan, Erdem S.
AU - Ozev, Sule
AU - Cauvet, Philippe
PY - 2008/9/19
Y1 - 2008/9/19
N2 - We present a diagnosis methodology for assembly failures in RF front-end circuits embedded in System-in-Package (SiP) designs. We focus on technologies where nonlinear components reside on several active dies and the linear components reside on a passive base. While there can be many pin connections between the base and the active die in these designs, there are only a few outside pins available. We present a systematic analysis technique to select viable test conditions to distinguish among the faults. Normal operation mode as well as non-functional mode test signals are used to increase the diagnostic resolution. We show that most assembly faults can be distinguished from one another using non-functional mode test signals on a generic LNA circuit. We also apply our technique to a commercial tuner for a subset of representative faults and reach the same conclusions.
AB - We present a diagnosis methodology for assembly failures in RF front-end circuits embedded in System-in-Package (SiP) designs. We focus on technologies where nonlinear components reside on several active dies and the linear components reside on a passive base. While there can be many pin connections between the base and the active die in these designs, there are only a few outside pins available. We present a systematic analysis technique to select viable test conditions to distinguish among the faults. Normal operation mode as well as non-functional mode test signals are used to increase the diagnostic resolution. We show that most assembly faults can be distinguished from one another using non-functional mode test signals on a generic LNA circuit. We also apply our technique to a commercial tuner for a subset of representative faults and reach the same conclusions.
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U2 - 10.1109/ISCAS.2008.4541910
DO - 10.1109/ISCAS.2008.4541910
M3 - Conference contribution
SN - 9781424416844
T3 - Proceedings - IEEE International Symposium on Circuits and Systems
SP - 2286
EP - 2289
BT - 2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008
T2 - 2008 IEEE International Symposium on Circuits and Systems, ISCAS 2008
Y2 - 18 May 2008 through 21 May 2008
ER -