Abstract
By comparing against in-house experimental measurements, this study evaluates the numerical simulations of hygro/thermo-mechanical deformations in polymer structures commonly used in electronic packages The simulations are achieved by using the finite element method (FEM). Two different material characterization techniques are utilized for displacements and/or strains due to both moisture and thermal loading.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 883-889 |
| Number of pages | 7 |
| Journal | Proceedings - Electronic Components and Technology Conference |
| Volume | 1 |
| State | Published - 2004 |
| Event | 2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States Duration: Jun 1 2004 → Jun 4 2004 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering