Abstract
Separate and non-interfering photo-resist molded metal-electroplating processes have been applied to the fabrication of inertia micro-switches and their wafer-level packaging in sealed cavities. The height of a switch and that of its cavity are independently controlled. The low process temperature allows eventual modular integration of switches on active substrates containing pre-fabricated electronic signal-processing circuits. The scheme also provides leads for electrical access to the sealed devices. The switches were designed using a simple but accurate lumped spring-mass model. With the application of an anti-stiction hydrophobic coating, un-encapsulated switches making over 100 million contacts have been demonstrated in room ambient.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 63-70 |
| Number of pages | 8 |
| Journal | Sensors and Actuators, A: Physical |
| Volume | 111 |
| Issue number | 1 |
| DOIs | |
| State | Published - Mar 1 2004 |
| Event | Micromechanics Section of Sensors and Actuators, based on - Kyoto, Japan Duration: Jan 19 2003 → Jan 23 2003 |
Keywords
- Anti-stiction coating
- Electroplating
- Eutectic solder bonding
- Inertia micro-switch
- Packaging
- Threshold acceleration
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Instrumentation
- Condensed Matter Physics
- Surfaces, Coatings and Films
- Metals and Alloys
- Electrical and Electronic Engineering