Fabrication issues for free-space optics at the board packaging level

Raymond K Kostuk

doi:10.1109/MPPOI.1994.336612

Fabrication issues for free-space optics at the board packaging level

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The succesful application of optical interconnects to electronic processing systems requires careful consideration of the: 1) electronic system in which it will be used, 2) optical system and electro-optical device performance, 3) electrical-electro optic interface characteristics, 4) packaging of micro optic components and electro-optic devices with electronic substrates, and 5) the reliability of optical interconnects. In addition, the optical system must be performance and cost competitive with advanced electrical connection methods. In this presentation we consider several of the above issues at the board packaging level, and the design of relevant optical components for these systems.

Original language	English (US)
Title of host publication	Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	45-51
Number of pages	7
ISBN (Electronic)	0818658320, 9780818658327
DOIs	https://doi.org/10.1109/MPPOI.1994.336612
State	Published - 1994
Event	1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994 - Cancun, Mexico Duration: Apr 26 1994 → Apr 27 1994

Publication series

Name	Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994

Conference

Conference	1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994
Country/Territory	Mexico
City	Cancun
Period	4/26/94 → 4/27/94

ASJC Scopus subject areas

Computer Networks and Communications
Hardware and Architecture
Atomic and Molecular Physics, and Optics

Access to Document

10.1109/MPPOI.1994.336612

Cite this

Kostuk, R. K. (1994). Fabrication issues for free-space optics at the board packaging level. In Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994 (pp. 45-51). Article 336612 (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MPPOI.1994.336612

Fabrication issues for free-space optics at the board packaging level. / Kostuk, Raymond K.
Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. Institute of Electrical and Electronics Engineers Inc., 1994. p. 45-51 336612 (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kostuk, RK 1994, Fabrication issues for free-space optics at the board packaging level. in Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994., 336612, Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994, Institute of Electrical and Electronics Engineers Inc., pp. 45-51, 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994, Cancun, Mexico, 4/26/94. https://doi.org/10.1109/MPPOI.1994.336612

Kostuk RK. Fabrication issues for free-space optics at the board packaging level. In Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. Institute of Electrical and Electronics Engineers Inc. 1994. p. 45-51. 336612. (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994). doi: 10.1109/MPPOI.1994.336612

Kostuk, Raymond K. / Fabrication issues for free-space optics at the board packaging level. Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994. Institute of Electrical and Electronics Engineers Inc., 1994. pp. 45-51 (Proceedings of the 1st International Workshop on Massively Parallel Processing Using Optical Interconnections, MPPOI 1994).

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Fabrication issues for free-space optics at the board packaging level

Abstract

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