Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis

Leila J. Ladani

doi:10.1504/IJMPT.2010.031431

Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis

Leila J. Ladani

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.

Original language	English (US)
Pages (from-to)	312-327
Number of pages	16
Journal	International Journal of Materials and Product Technology
Volume	37
Issue number	3-4
DOIs	https://doi.org/10.1504/IJMPT.2010.031431
State	Published - Feb 2010
Externally published	Yes

Keywords

BGA
Ball grid array
Design of experiment
Failure analysis
Manufacturing process
Solder joint

ASJC Scopus subject areas

Safety, Risk, Reliability and Quality
Mechanics of Materials
Mechanical Engineering
Industrial and Manufacturing Engineering

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10.1504/IJMPT.2010.031431

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title = "Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis",

abstract = "A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.",

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AU - Ladani, Leila J.

PY - 2010/2

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N2 - A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.

AB - A comprehensive three level design of experiment that is applied on the manufacturing process to compare the effect of variability in printing and reflow processes on quality and durability of Micro Lead Frame (MLF) and Ball Grid Array (BGA) components. The quality and durability of the BGA and MLF components were studied very closely by thermo-mechanical experiment and finite element simulation. Different populations of failures indicating different failure site and mechanisms were observed in both BGA and MLF components. Conflictions were observed when parameter variations caused durability improvement in one type and durability degradation in the other package.

KW - BGA

KW - Ball grid array

KW - Design of experiment

KW - Failure analysis

KW - Manufacturing process

KW - Solder joint

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DO - 10.1504/IJMPT.2010.031431

M3 - Article

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VL - 37

SP - 312

EP - 327

JO - International Journal of Materials and Product Technology

JF - International Journal of Materials and Product Technology

IS - 3-4

ER -

Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis

Abstract

Keywords

ASJC Scopus subject areas

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