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Film/substrate thermal boundary resistance for an Er-Ba-Cu-O high-Tc superconducting film

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The thermal boundary resistance, Rbd, at the film/substrate interface is crucially important to the thermal design of electronic and opto-electronic devices made from high-Tc superconducting thin films. Direct measurement of Rbd, however, has been limited to temperatures well above the boiling point of nitrogen, or out of the likely operating range of high-Tc devices. Here, an experiment is carried out on an Er-Ba-Cu-O thin film deposited on an MgO substrate, in which the film is etched into a double meander pattern consisting of two adjacent high-Tc strips. One strip is used as the heater, while the other is used to determine the substrate temperature. In general, the measured values of Rbd are far above those reported earlier; however, due to uncertainties in the temperature determination of the heater strip caused by its current-dependent resistance, much of the data is suspect. The most reliable data indicate that Rbd≈0.1 K cm2 W-1 at ≈100 K. Furthermore, the data suggest that Rbd may be a function of the heat flux.

Original languageEnglish (US)
Title of host publicationHeat Transfer in Superconducting Equipment
PublisherPubl by ASME
Pages33-38
Number of pages6
ISBN (Print)0791810771
StatePublished - Dec 1 1992
Externally publishedYes
EventWinter Annual Meeting of the American Society of Mechanical Engineers - Anaheim, CA, USA
Duration: Nov 8 1992Nov 13 1992

Publication series

NameAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume229

Other

OtherWinter Annual Meeting of the American Society of Mechanical Engineers
CityAnaheim, CA, USA
Period11/8/9211/13/92

ASJC Scopus subject areas

  • Mechanical Engineering
  • Fluid Flow and Transfer Processes

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