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Finite element modeling of BGA packages for life prediction
G. Gustafsson
, I. Guven
, V. Kradinov
,
E. Madenci
Aerospace & Mechanical Engr
Research output
:
Contribution to journal
›
Article
›
peer-review
63
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Keyphrases
Finite Element Modeling
100%
Life Prediction
100%
Global Model
100%
BGA Package
100%
Finite Element Model
40%
Electronic Packaging
40%
Global Analysis
40%
Prediction Analysis
40%
Characteristic Life
40%
Slice Model
40%
Prediction Method
20%
Reliability Analysis
20%
Solder Joint
20%
Thermal Cycling
20%
Material Composition
20%
Displacement Field
20%
Plastic Work
20%
Nonlinear Analysis
20%
Critical Assumption
20%
Work Density
20%
Hysteresis Loop
20%
Empirical Constants
20%
Superelement
20%
Geometric Composition
20%
Solder Joint Reliability
20%
Modeling Assumptions
20%
Refined Mesh
20%
Engineering
Life Prediction
100%
Fem Model
100%
Finite Element Modeling
40%
Joints (Structural Components)
40%
Characteristic Life
40%
Experimental Measurement
20%
Lifecycle
20%
Material Composition
20%
Thermal Cycle
20%
Reliability Analysis
20%
Plastic Work
20%
Displacement Field
20%
Nonlinear Analysis
20%
Refined Mesh
20%
Hysteresis Loop
20%
Super Element
20%
Boundary Condition
20%