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Implications of wafer-size scale-up on frictional, thermal, and kinetic attributes of interlayer dielectric CMP process

  • D. Rosales-Yeomans
  • , L. Borucki
  • , T. Doi
  • , L. Lujan
  • , A. Philipossian

Research output: Contribution to journal › Article › peer-review

16   Link opens in a new tab Scopus citations

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