Abstract
Dual Emission Laser Induced Fluorescence (DELIF) is employed to attempt to experimentally determine the nature of the lubrication regime in Chemical Mechanical Planarization. Our DELIF setup provides images of the polishing slurry between the wafer and pad. Static images were taken to provide a baseline, then dynamic runs were conducted. Analyzing these images shows that the wafer only contacts the pad in a small number of places around the wafer, mainly due to the pad's topography.
Original language | English (US) |
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Article number | W2.3 |
Pages (from-to) | 167-173 |
Number of pages | 7 |
Journal | Materials Research Society Symposium Proceedings |
Volume | 867 |
DOIs | |
State | Published - 2005 |
Event | 2005 Materials Research Society Spring Meeting - San Francisco, CA, United States Duration: Mar 28 2005 → Mar 31 2005 |
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering