Inter- and transgranular nucleation and growth of voids in shock loaded copper bicrystals

Keyphrases

• Grain Boundary 100%
• Shock 100%
• Void Growth 100%
• Copper Bicrystal 100%
• Transgranular 100%
• Pulse Duration 66%
• Crystal Orientation 33%
• Scanning Electron Microscopy 33%
• Stress Level 33%
• Failure Behavior 33%
• Damage Growth 33%
• Electron Backscatter Diffraction 33%
• Void Coalescence 33%
• Spall 33%
• Microstructural 33%
• Sample Characterization 33%
• Dynamic Deformation 33%
• Bicrystal 33%
• Flyer Plate Impact 33%
• Dynamic Damage 33%
• Threshold Level 33%
• Polycrystalline Metals 33%
• Extreme Loading Conditions 33%
• Grain Bulks 33%
• Shock Stress 33%
• Pulse Stress 33%
• Boundary Misorientation 33%
• Void nucleation 33%
• Fixed Boundary 33%

Engineering

• Grain Boundary 100%
• Bicrystal 100%
• Pulse Duration 66%
• Crystal Orientation 33%
• Stress Level 33%
• Failure Behavior 33%
• Loading Condition 33%
• Macroscale 33%
• Damage Growth 33%
• Experimental Result 33%
• Dynamic Deformation 33%
• Polycrystalline Metal 33%
• Extreme Loading 33%

Material Science

• Grain Boundary 100%
• Nucleation 100%
• Bicrystal 100%
• Crystal Orientation 33%
• Scanning Electron Microscopy 33%
• Electron Backscatter Diffraction 33%