Abstract
We report for the first time the use of orientation dependent etching (ODE) of (110) c-Si in sidewall thin film technology for imprint mask fabrication with low line edge roughness (LER) over a large area. Oxidation is used for sidewall thin film formation with a good critical dimension control. 2-dimensional oxidation effects are discussed. Features down to 12 nm have been fabricated successfully. Simulation shows that the fabricated oxide line is strong enough to imprint both thermoplastic and photo-curable imprint resists.
Original language | English (US) |
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Article number | 41 |
Pages (from-to) | 382-391 |
Number of pages | 10 |
Journal | Progress in Biomedical Optics and Imaging - Proceedings of SPIE |
Volume | 5751 |
Issue number | I |
DOIs | |
State | Published - 2005 |
Event | Emerging Lithographic Technologies IX - San Jose, CA, United States Duration: Mar 1 2005 → Mar 3 2005 |
Keywords
- 2-dimensional oxidation
- Crystalline silicon
- Imprint lithography
- Mask fabrication
- Orientation dependent etching
- Sidewall thin-film
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Radiology Nuclear Medicine and imaging
- Biomaterials