Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors

Atul Joshi; David J. Chiaverini; Sachin Kashyap; Vishwanath Madhugiri; Robert Patti; Sangki Hong; Michael Lesser

doi:10.1117/12.2588181

Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors

Atul Joshi, David J. Chiaverini, Sachin Kashyap, Vishwanath Madhugiri, Robert Patti, Sangki Hong, Michael Lesser

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

An 8-inch wafer scale process was developed that provides low cost availability of back-side illuminated (BSI) imaging sensors. The process has been optimized to convert standard CMOS and CCD 6-inch or 8-inch wafers from front side illuminated (FSI) sensors to BSI sensors. The process successfully demonstrates wafer planarization, bow correction, bonding to carrier wafers, wafer thinning, re-planarization, anti-reflection coating, through silicon vias (TSVs) and back side metallization. Good wafer thinning control was obtained for a wide range of epi thicknesses varying from 4 microns to 15 microns. The thinner epi is optimized for UV and visible sensing while the thicker epi material is optimized for near-infrared (NIR) sensing. The processed wafers demonstrate backside passivation and anti-reflection (AR) coatings that optimize the QE performance in a variety of bands such as 200nm-300nm, 300nm-400nm and 400nm-900nm.

Original language	English (US)
Title of host publication	Image Sensing Technologies
Subtitle of host publication	Materials, Devices, Systems, and Applications VIII
Editors	Nibir K. Dhar, Achyut K. Dutta, Sachidananda R. Babu
Publisher	SPIE
ISBN (Electronic)	9781510642836
DOIs	https://doi.org/10.1117/12.2588181
State	Published - 2021
Event	Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII 2021 - Virtual, Online, United States Duration: Apr 12 2021 → Apr 16 2021

Publication series

Name	Proceedings of SPIE - The International Society for Optical Engineering
Volume	11723

Conference

Conference	Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII 2021
Country/Territory	United States
City	Virtual, Online
Period	4/12/21 → 4/16/21

Keywords

Back side illumination (BSI)
CCD image sensor
CMOS image sensor (CIS)
Front side illumination (FSI)
NIR
Planarization
Silicon wafer process
UV
Wafer bonding
Wafer thinning

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

Access to Document

10.1117/12.2588181

Cite this

Joshi, A., Chiaverini, D. J., Kashyap, S., Madhugiri, V., Patti, R., Hong, S., & Lesser, M. (2021). Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors. In N. K. Dhar, A. K. Dutta, & S. R. Babu (Eds.), Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII Article 1172308 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11723). SPIE. https://doi.org/10.1117/12.2588181

Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors. / Joshi, Atul; Chiaverini, David J.; Kashyap, Sachin et al.
Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII. ed. / Nibir K. Dhar; Achyut K. Dutta; Sachidananda R. Babu. SPIE, 2021. 1172308 (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 11723).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Joshi, A, Chiaverini, DJ, Kashyap, S, Madhugiri, V, Patti, R, Hong, S & Lesser, M 2021, Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors. in NK Dhar, AK Dutta & SR Babu (eds), Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII., 1172308, Proceedings of SPIE - The International Society for Optical Engineering, vol. 11723, SPIE, Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII 2021, Virtual, Online, United States, 4/12/21. https://doi.org/10.1117/12.2588181

Joshi A, Chiaverini DJ, Kashyap S, Madhugiri V, Patti R, Hong S et al. Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors. In Dhar NK, Dutta AK, Babu SR, editors, Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII. SPIE. 2021. 1172308. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.2588181

Joshi, Atul ; Chiaverini, David J. ; Kashyap, Sachin et al. / Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors. Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII. editor / Nibir K. Dhar ; Achyut K. Dutta ; Sachidananda R. Babu. SPIE, 2021. (Proceedings of SPIE - The International Society for Optical Engineering).

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Novel 8-inch wafer scale process for low-cost production of back side illuminated (BSI) imaging sensors

Abstract

Publication series

Conference

Keywords

ASJC Scopus subject areas

Access to Document

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