TY - GEN
T1 - Optimizing latency, energy, and reliability of 1T1R ReRAM through appropriate voltage settings
AU - Mao, Manqing
AU - Cao, Yu
AU - Chakrabarti, Chaitali
N1 - Publisher Copyright: © 2015 IEEE.
PY - 2015/12/14
Y1 - 2015/12/14
N2 - Resistive RAM (ReRAM) has fast access time, ultra-low stand-by power and high reliability, making it a viable memory technology to replace DRAM for main memory. The 1-Transistor-1-resistor (1T1R) ReRAM array has density comparable to that of a DRAM array and the advantages of lower programming energy and higher reliability compared to the ultrahigh density ReRAM cross-point array. In this paper, we show how circuit operation parameters, such as the pulse amplitude and pulse widths of word-line (WL) voltage, bit-line (BL) voltage, and source-line (SL) voltage can be used to lower latency, lower power and improve reliability. SPICE simulation results demonstrate that appropriate choice of voltage settings can be used to reduce the write latency of the 1T1R cell by 29.4% and reduce write energy by 46.7% over the DRAM cell. Next, we show how the endurance of ReRAM cell can be improved by increasing the ratio between OFF and ON resistances and reducing SL voltage. We find that of these, reducing the SL voltage results in significant improvement in endurance with smaller energy overhead. Next, we evaluate the system-level performance of a 1GB ReRAM and DRAM memory system using CACTI and GEM5. Simulation results using SPEC CPU INT 2006 and DaCapo-9.12 benchmarks show that the ReRAM based main memory can improve IPC by 4.2% and energy by up to 77.8% compared to a DRAM system.
AB - Resistive RAM (ReRAM) has fast access time, ultra-low stand-by power and high reliability, making it a viable memory technology to replace DRAM for main memory. The 1-Transistor-1-resistor (1T1R) ReRAM array has density comparable to that of a DRAM array and the advantages of lower programming energy and higher reliability compared to the ultrahigh density ReRAM cross-point array. In this paper, we show how circuit operation parameters, such as the pulse amplitude and pulse widths of word-line (WL) voltage, bit-line (BL) voltage, and source-line (SL) voltage can be used to lower latency, lower power and improve reliability. SPICE simulation results demonstrate that appropriate choice of voltage settings can be used to reduce the write latency of the 1T1R cell by 29.4% and reduce write energy by 46.7% over the DRAM cell. Next, we show how the endurance of ReRAM cell can be improved by increasing the ratio between OFF and ON resistances and reducing SL voltage. We find that of these, reducing the SL voltage results in significant improvement in endurance with smaller energy overhead. Next, we evaluate the system-level performance of a 1GB ReRAM and DRAM memory system using CACTI and GEM5. Simulation results using SPEC CPU INT 2006 and DaCapo-9.12 benchmarks show that the ReRAM based main memory can improve IPC by 4.2% and energy by up to 77.8% compared to a DRAM system.
KW - 1T1R ReRAM
KW - IPC
KW - energy
KW - latency
KW - main memory
KW - reliability
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U2 - 10.1109/ICCD.2015.7357125
DO - 10.1109/ICCD.2015.7357125
M3 - Conference contribution
T3 - Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015
SP - 359
EP - 366
BT - Proceedings of the 33rd IEEE International Conference on Computer Design, ICCD 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd IEEE International Conference on Computer Design, ICCD 2015
Y2 - 18 October 2015 through 21 October 2015
ER -