Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework

Yanan Zhang, Sundaram Vinod K. Anicode, Xuejun Fan, Erdogan Madenci

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

This study presents a peridynamic model to predict void formation and growth in metal lines due to electromigration. The nonlocal form of the nonlinear governing equations and boundary conditions for electromigration are derived by using the peridynamic differential operator (PDDO). The equation of motion includes the effect of diffusion strain due to electromigration. Coupled governing equations of atomic concentration and deformation are solved in the Ansys framework with native elements through implicit algorithms. The numerical results show that the current approach can accurately predict the distribution of the deformation, atomic concentration, and hydrostatic stress. Also, the void growth predictions agree well with the experimental predictions.

Original languageEnglish (US)
Article number116183
JournalComputer Methods in Applied Mechanics and Engineering
Volume414
DOIs
StatePublished - Sep 1 2023

Keywords

  • ANSYS
  • Electromigration
  • Metal line
  • Peridynamic
  • Void length

ASJC Scopus subject areas

  • Computational Mechanics
  • Mechanics of Materials
  • Mechanical Engineering
  • General Physics and Astronomy
  • Computer Science Applications

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