TY - GEN
T1 - Peridynamic theory for failure prediction in multilayer thin-film structures of electronic packages
AU - Agwai, Abigail
AU - Guven, Ibrahim
AU - Madenci, Erdogan
PY - 2008
Y1 - 2008
N2 - This study presents an application of the peridynamic theory to investigate failure propagation in a multi-layer thin-film structure of electronic packages. A brief description of this non-local theory is presented prior to the statement of the problem. The mathematical description of the theory and its validation by considering a well-known dynamic fracture problem are discussed subsequently. Finally, the crack propagation path in a multilayer thin-film structure predicted by the peridynamic theory was compared against measurements from nanoindentation experiments.
AB - This study presents an application of the peridynamic theory to investigate failure propagation in a multi-layer thin-film structure of electronic packages. A brief description of this non-local theory is presented prior to the statement of the problem. The mathematical description of the theory and its validation by considering a well-known dynamic fracture problem are discussed subsequently. Finally, the crack propagation path in a multilayer thin-film structure predicted by the peridynamic theory was compared against measurements from nanoindentation experiments.
UR - http://www.scopus.com/inward/record.url?scp=51349146671&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=51349146671&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2008.4550192
DO - 10.1109/ECTC.2008.4550192
M3 - Conference contribution
SN - 9781424422302
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1614
EP - 1619
BT - 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC
T2 - 2008 58th Electronic Components and Technology Conference, ECTC
Y2 - 27 May 2008 through 30 May 2008
ER -