TY - GEN
T1 - Post assembly warpage prediction using refined zigzag element
AU - Kilic, Bahattin
AU - Barut, Atila
AU - Madenci, Erdogan
PY - 2013
Y1 - 2013
N2 - Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.
AB - Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.
UR - http://www.scopus.com/inward/record.url?scp=84883377587&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84883377587&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2013.6575896
DO - 10.1109/ECTC.2013.6575896
M3 - Conference contribution
SN - 9781479902330
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2255
EP - 2258
BT - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
T2 - 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Y2 - 28 May 2013 through 31 May 2013
ER -