Abstract
A potentially manufacturable liquid source metalorganic chemical vapor deposition process was successfully applied to deposit Iridium films on a variety of substrates. The depositions of Ir were carried out in the temperature range of 300-450 °C from tetrahydrofuran (THF) solution of CH3CpIrCOD (Cp = cyclopentadienyl, COD = cyclooctadiene) in a low-pressure, hot-wall reactor. Oxygen assisted pyrolysis of the precursor at 350 °C resulted in a remarkably high Ir growth rate of 70 nm/min on IrOx/Si substrate. Additionally, Ir on Si exhibited a room-temperature resistivity of 10.2 μΩcm. The as-deposited polycrystalline Ir films were highly reflecting, dense, and fine grained.
| Original language | English (US) |
|---|---|
| Pages (from-to) | L1052-L1054 |
| Journal | Japanese Journal of Applied Physics, Part 2: Letters |
| Volume | 38 |
| Issue number | 9 A/B |
| DOIs | |
| State | Published - Sep 15 1999 |
ASJC Scopus subject areas
- General Engineering
- General Physics and Astronomy
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