Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management

Tae Ho Kim; Won Mook Choi; Dae Hyeong Kim; Matthew A. Meitl; Etienne Menard; Hanqing Jiang; John A. Carlisle; John A. Rogers

doi:10.1002/adma.200702434

Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management

Tae Ho Kim
, Won Mook Choi
, Dae Hyeong Kim
, Matthew A. Meitl
, Etienne Menard
, Hanqing Jiang
, John A. Carlisle
, John A. Rogers

Research output: Contribution to journal › Article › peer-review

84 Scopus citations

Abstract

Etching and printing techniques that are used to manipulate thin film microstructures of diamond in a way that allows integration with substrates and creation of structural forms that are incompatible with conventional processing was investigated. A SiO₂ layer was deposited by plasma-enhanced chemical vapor deposition (PECVD) using SiH₄ and N₂O at 250°C. Photolithography with AZ 5214 defined a pattern of photoresist (PR) on the surface of the SiO₂ (300 nm)/UNCD (400 nm)/SiO₂/Si substrate. The PR served as a mask for RIE etching of the PECVD SiO₂ layer with a Cf₄ plasma. It was observed that the resulting capabilities could be useful for certain applications, such as those in thermal management for plastic electronics.

Original language	English (US)
Pages (from-to)	2171-2176
Number of pages	6
Journal	Advanced Materials
Volume	20
Issue number	11
DOIs	https://doi.org/10.1002/adma.200702434
State	Published - Jun 4 2008

ASJC Scopus subject areas

General Materials Science
Mechanics of Materials
Mechanical Engineering

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10.1002/adma.200702434

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abstract = "Etching and printing techniques that are used to manipulate thin film microstructures of diamond in a way that allows integration with substrates and creation of structural forms that are incompatible with conventional processing was investigated. A SiO2 layer was deposited by plasma-enhanced chemical vapor deposition (PECVD) using SiH4 and N2O at 250°C. Photolithography with AZ 5214 defined a pattern of photoresist (PR) on the surface of the SiO2 (300 nm)/UNCD (400 nm)/SiO2/Si substrate. The PR served as a mask for RIE etching of the PECVD SiO2 layer with a Cf4 plasma. It was observed that the resulting capabilities could be useful for certain applications, such as those in thermal management for plastic electronics.",

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T1 - Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management

AU - Kim, Tae Ho

AU - Choi, Won Mook

AU - Kim, Dae Hyeong

AU - Meitl, Matthew A.

AU - Menard, Etienne

AU - Jiang, Hanqing

AU - Carlisle, John A.

AU - Rogers, John A.

PY - 2008/6/4

Y1 - 2008/6/4

N2 - Etching and printing techniques that are used to manipulate thin film microstructures of diamond in a way that allows integration with substrates and creation of structural forms that are incompatible with conventional processing was investigated. A SiO2 layer was deposited by plasma-enhanced chemical vapor deposition (PECVD) using SiH4 and N2O at 250°C. Photolithography with AZ 5214 defined a pattern of photoresist (PR) on the surface of the SiO2 (300 nm)/UNCD (400 nm)/SiO2/Si substrate. The PR served as a mask for RIE etching of the PECVD SiO2 layer with a Cf4 plasma. It was observed that the resulting capabilities could be useful for certain applications, such as those in thermal management for plastic electronics.

AB - Etching and printing techniques that are used to manipulate thin film microstructures of diamond in a way that allows integration with substrates and creation of structural forms that are incompatible with conventional processing was investigated. A SiO2 layer was deposited by plasma-enhanced chemical vapor deposition (PECVD) using SiH4 and N2O at 250°C. Photolithography with AZ 5214 defined a pattern of photoresist (PR) on the surface of the SiO2 (300 nm)/UNCD (400 nm)/SiO2/Si substrate. The PR served as a mask for RIE etching of the PECVD SiO2 layer with a Cf4 plasma. It was observed that the resulting capabilities could be useful for certain applications, such as those in thermal management for plastic electronics.

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ER -

Printable, flexible, and stretchable forms of ultrananocrystalline diamond with applications in thermal management

Abstract

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