@inproceedings{a2e72a009eb44242ae564effe9f166c7,
title = "Progress in optimization of high-power, high-speed VCSEL arrays",
abstract = "Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable optical power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. Performance of these devices is critically dependent both on the design of the VCSEL devices and the design of the sub-mount, which provides both the electrical and thermal contacts for the array. Recent results for modelling and optimization of the VCSELs and their corresponding sub-mounts are discussed.",
keywords = "Automotive temperature requirements, Integrated micro-lens, Laser array, Laser illumination, LiDAR, Principle stress, Shear stress, VCSEL",
author = "Rosprim, \{James P.\} and Li Wang and David Podva and Martin, \{Eric J.J.\} and Preethi Dacha and Helms, \{Christopher J.\} and Thomas Wilcox and Li, \{Nein Yi\} and Carson, \{Richard F.\} and Warren, \{Mial E.\} and Lott, \{James A.\}",
note = "Publisher Copyright: {\textcopyright} 2017 SPIE.; Vertical-Cavity Surface-Emitting Lasers XXI ; Conference date: 01-02-2017 Through 02-02-2017",
year = "2017",
doi = "10.1117/12.2253142",
language = "English (US)",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Choquette, \{Kent D.\} and Chun Lei",
booktitle = "Vertical-Cavity Surface-Emitting Lasers XXI",
}