Review of thermal boundary resistance of high-temperature superconductors

Solid-solid thermal boundary resistance plays an important role in the thermal stability of many electronic circuits, microdevices, and superconducting devices. The thermal boundary resistance (R_b) at any interface causes a temperature discontinuity, which can result in heat accumulation on one side of the boundary and raise the temperature much above the stable region, causing device failure. With the advent of high-critical-temperature (high-T_c) superconductors, it is possible to make superconducting devices at practically achievable temperatures. As the current trend goes toward the development of more and more high-T_c superconducting devices, the need for a better understanding of the thermal boundary resistance of high-T_c superconductors becomes mandatory. This paper compiles all the theoretical and experimental work to date on R_b in high-T_c superconductors, both in thin-film and bulk forms, and provides a critical review of the cited works. This paper also describes the possible effect of the superconducting state on R_b for high-T_c superconductors, based on the experiments for both high-T_c and low-T_c bulk superconductors, and a possible explanation for these data based on the existing theory for low-T_c superconductors.