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Shelf packing to the design and optimization of a power-aware multi-frequency wrapper architecture for modular IP cores

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper proposes a novel power-aware multi-frequency wrapper architecture design to achieve at-speed testability. The trade-offs between power dissipation, scan time and bandwidth are well handled by gating off certain virtual cores at a time while parallelizing the remaining. A shelf packing based optimization algorithm is proposed to design and optimize the wrapper architecture while minimizing the test time under power and bandwidth constraints.

Original languageEnglish (US)
Title of host publicationProceedings of the ASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007
Pages714-719
Number of pages6
DOIs
StatePublished - 2007
Externally publishedYes
EventASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007 - Yokohama, Japan
Duration: Jan 23 2007 → Jan 27 2007

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC

Other

OtherASP-DAC 2007 - Asia and South Pacific Design Automation Conference 2007
Country/TerritoryJapan
CityYokohama
Period1/23/07 → 1/27/07

ASJC Scopus subject areas

  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design
  • Electrical and Electronic Engineering

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