TY - JOUR
T1 - Treatment of copper from Cu CMP waste streams using polyethyleneimine
AU - Maketon, Worawan Kay
AU - Ogden, Kimberly L.
N1 - Funding Information: Manuscript received June 7, 2007; revised April 4, 2008. Published August 6, 2008 (projected). This work was supported by NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing. W. K. Maketon is with the Intel Corporation, Rio Rancho, NM 87124 USA (e-mail: [email protected]). K. L. Ogden is with the Department of Chemical and Environmental Engineering, University of Arizona, Tucson, AZ 85721 USA (e-mail: ogden@email. arizona.edu) Digital Object Identifier 10.1109/TSM.2008.2001226
PY - 2008/8
Y1 - 2008/8
N2 - Commercially available Cu CMP waste treatment processes involve: 1) pretreatment chemistry using oxidizers to break down complexed copper resulting in precipitation of copper in the form of copper hydroxide; 2) microfiltration of both slurry particles and copper hydroxide; and 3) ion exchange to remove Cu2+ ions. Ion exchange resins used to remove Cu2+ ions are limited to only removing cations and also have a low efficiency in binding Cu2+ ions. The treatment strategy to be evaluated here only requires using two processes to remove the copper from Cu CMP waste-filtration to remove the particles followed by chelation. This paper focuses on the chelation step. The chelator of interest is polyethyleneimine (PEI) bound to agarose beads. PEI removes both Cu2+ ions and Cu-complexes. The particles from slurry in the actual Cu CMP waste were removed by filtration before the experiment. The results show that PEI has a higher binding capacity for Cu2+ ions than ion exchange resins. Its performance and reproducibility did not change after multiple regenerations. Furthermore, PEI has the ability to bind Cu-complexes through electrostatic attraction. Although the bonds aren't strong, the result is more overall copper removal from the waste stream. The copper component of the Cu CMP waste was concentrated 12 fold using this system.
AB - Commercially available Cu CMP waste treatment processes involve: 1) pretreatment chemistry using oxidizers to break down complexed copper resulting in precipitation of copper in the form of copper hydroxide; 2) microfiltration of both slurry particles and copper hydroxide; and 3) ion exchange to remove Cu2+ ions. Ion exchange resins used to remove Cu2+ ions are limited to only removing cations and also have a low efficiency in binding Cu2+ ions. The treatment strategy to be evaluated here only requires using two processes to remove the copper from Cu CMP waste-filtration to remove the particles followed by chelation. This paper focuses on the chelation step. The chelator of interest is polyethyleneimine (PEI) bound to agarose beads. PEI removes both Cu2+ ions and Cu-complexes. The particles from slurry in the actual Cu CMP waste were removed by filtration before the experiment. The results show that PEI has a higher binding capacity for Cu2+ ions than ion exchange resins. Its performance and reproducibility did not change after multiple regenerations. Furthermore, PEI has the ability to bind Cu-complexes through electrostatic attraction. Although the bonds aren't strong, the result is more overall copper removal from the waste stream. The copper component of the Cu CMP waste was concentrated 12 fold using this system.
KW - Chelators
KW - Chemical-mechanical planarization (CMP)
KW - Cu CMP waste treatment
KW - Polyethyleneimine (PEI)
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U2 - 10.1109/TSM.2008.2001226
DO - 10.1109/TSM.2008.2001226
M3 - Article
SN - 0894-6507
VL - 21
SP - 481
EP - 485
JO - IEEE Transactions on Semiconductor Manufacturing
JF - IEEE Transactions on Semiconductor Manufacturing
IS - 3
M1 - 4589038
ER -