TY - GEN
T1 - Uniform metal-assisted chemical etching and the stability of catalysts
AU - Li, Liyi
AU - Holmes, Colin M.
AU - Hah, Jinho
AU - Wong, Ching P.
N1 - Publisher Copyright: © 2015 Materials Research Society.
PY - 2015
Y1 - 2015
N2 - Recently, metal-assisted chemical etching (MaCE) has been demonstrated as a promising technology in fabrication of uniform high-aspect-ratio (HAR) micro- and nanostructures on silicon substrates. In this work, MaCE experiments on 2 um-wide line patterns were conducted using Au or Ag as catalysts. The performance of the two catalysts show sharp contrast. In MaCE with Au, a HAR trench was formed with uniform geometry and vertical sidewall. In MaCE with Ag, shallow and tapered etching profiles were observed, which resembled the results from isotropic etching. The sidewall tapering phenomena can be explained by the dissolution and re-deposition of the Ag catalyst in the etchant solution. The existence of Ag that was redeposited on the sidewall was further confirmed by energy dispersive spectrum. Also, etchant composition is found to play a profound role in influencing the etching profile by the Ag catalysts.
AB - Recently, metal-assisted chemical etching (MaCE) has been demonstrated as a promising technology in fabrication of uniform high-aspect-ratio (HAR) micro- and nanostructures on silicon substrates. In this work, MaCE experiments on 2 um-wide line patterns were conducted using Au or Ag as catalysts. The performance of the two catalysts show sharp contrast. In MaCE with Au, a HAR trench was formed with uniform geometry and vertical sidewall. In MaCE with Ag, shallow and tapered etching profiles were observed, which resembled the results from isotropic etching. The sidewall tapering phenomena can be explained by the dissolution and re-deposition of the Ag catalyst in the etchant solution. The existence of Ag that was redeposited on the sidewall was further confirmed by energy dispersive spectrum. Also, etchant composition is found to play a profound role in influencing the etching profile by the Ag catalysts.
UR - https://www.scopus.com/pages/publications/84985991137
UR - https://www.scopus.com/pages/publications/84985991137#tab=citedBy
U2 - 10.1557/opl.2015.574
DO - 10.1557/opl.2015.574
M3 - Conference contribution
T3 - Materials Research Society Symposium Proceedings
SP - 1
EP - 8
BT - Metal-Assisted Chemical Etching of Silicon and Other Semiconductors
A2 - Rykaczewski, Konrad
A2 - Li, Xiuling
A2 - Huang, Zhipeng
A2 - Hildreth, Owen
PB - Materials Research Society
T2 - 2015 MRS Spring Meeting
Y2 - 6 April 2015 through 10 April 2015
ER -